@misc{WunderleMayCirulisetal., author = {Wunderle, B. and May, D. and Cirulis, I. and Braun, S. and Zschenderlein, U. and Heilmann, J. and T{\"u}rk, P. and Pantou, R. and Schacht, R. and Rzepka, R. and Ras, M. Abo and Kurth, S. and Kuhn, H.}, title = {Full-field IR-thermography for bond-quality inspection of electroplated aluminium interconnects for Cryo-SiP architectures}, series = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)}, journal = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, doi = {10.1109/ESTC60143.2024.10712030}, pages = {1 -- 9}, abstract = {This paper addresses thermal transient IR thermography as full-field and non-destructive failure analytical technique to determine the bond quality of microelectronic joints, exploiting the transparency of a silicon chip for MIR photons. The method is exemplified for C2C bonded electroplated Aluminium joints as they could come in as a novel joining technology for 3D heterogeneously integrated Cryo-SiP architectures for ion-trap based quantum computers. We have evaluated the method experimentally for different thermosonic bond parameters and validated it by metallographic sectioning. First results are shown. We could derive that the phase and amplitude image could be used to detect defects in the joints with good sensitivity and within reasonable testing times. This method could have potential to determine zero-hour quality of such joints during inline testing.}, language = {en} } @misc{MayWunderleCirulisetal., author = {May, D. and Wunderle, B. and Cirulis, I. and Braun, S. and Zschenderlein, U. and Heilmann, J. and Pantou, R. and Schacht, R. and Rzepka, R. and Ras, M. Abo and Kurth, S. and Kuhn, H.}, title = {Full-field through-chip IR-thermography-based quality testing \& failure analysis on electroplated aluminium interconnects for cryogenic applications in Ion-trap quantum computers}, series = {2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, journal = {2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, doi = {10.1109/EuroSimE60745.2024.10491500}, pages = {1 -- 8}, abstract = {This paper addresses thermal transient IR thermography as full-field and non-destructive failure analytical technique to determine the bond quality of microelectronic joints, exploiting the transparency of a silicon chip for MIR photons. The method is exemplified for C2C bonded electroplated Aluminium joints as they could come in as a novel joining technology for 3D heterogeneously integrated Cryo-SiP architectures for ion-trap based quantum computers. We have evaluated the method experimentally for different thermo sonic bond parameters and validated it by metallographic sectioning. First results are shown. We could derive that the phase and amplitude image could be used to detect defects in the joints with good sensitivity and within reasonable testing times. This method could have potential to determine zero-hour quality of such joints during inline testing}, language = {en} } @inproceedings{AboRasMaySchachtetal., author = {Abo Ras, Mohamad and May, Daniel and Schacht, Ralph and Bast, M. and Eisle, R. and Michel, Bernd and Winkler, Thomas and Rzepka, Sven and Wunderle, Bernhard}, title = {"LaTIMA" an Innovative Test Stand for Thermal and Electrical Characterization of Highly Conductive Metals, Die Attach, and Substrate Materials}, series = {21st International Workshop on Thermal Investigations of ICs and Systems, Sept. 30 2015 - Oct. 2 2015}, booktitle = {21st International Workshop on Thermal Investigations of ICs and Systems, Sept. 30 2015 - Oct. 2 2015}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-4673-9705-6}, pages = {6}, abstract = {This paper deals with the development of an innovative test stand for the measurement of thermal and electrical conductivity of metals, semiconductors, highly conductive die attaches and substrates using the steady state technique for thermal characterization and four-terminal sensing with pulse delta technique for electrical characterization. We present a systematic study of sintered silver in order to investigate the influence of sintering conditions on thermal and electrical properties. Several sintered silver samples have been prepared under sintering temperature variation between 200°C and 270°C and sintering pressure variation between 5 MPa and 25 MPa. The characterization results diversify up to 200\% for thermal conductivity and up to 330\% for electrical conductivity. The Wiedemann-France law describes the relationship between electrical and thermal conductivities for bulk metals. We proved that this law applies not only for bulk metal but also for porous sintered metal.}, language = {en} }