@misc{WunderleMayCirulisetal., author = {Wunderle, B. and May, D. and Cirulis, I. and Braun, S. and Zschenderlein, U. and Heilmann, J. and T{\"u}rk, P. and Pantou, R. and Schacht, R. and Rzepka, R. and Ras, M. Abo and Kurth, S. and Kuhn, H.}, title = {Full-field IR-thermography for bond-quality inspection of electroplated aluminium interconnects for Cryo-SiP architectures}, series = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)}, journal = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, doi = {10.1109/ESTC60143.2024.10712030}, pages = {1 -- 9}, abstract = {This paper addresses thermal transient IR thermography as full-field and non-destructive failure analytical technique to determine the bond quality of microelectronic joints, exploiting the transparency of a silicon chip for MIR photons. The method is exemplified for C2C bonded electroplated Aluminium joints as they could come in as a novel joining technology for 3D heterogeneously integrated Cryo-SiP architectures for ion-trap based quantum computers. We have evaluated the method experimentally for different thermosonic bond parameters and validated it by metallographic sectioning. First results are shown. We could derive that the phase and amplitude image could be used to detect defects in the joints with good sensitivity and within reasonable testing times. This method could have potential to determine zero-hour quality of such joints during inline testing.}, language = {en} } @misc{MayWunderleCirulisetal., author = {May, D. and Wunderle, B. and Cirulis, I. and Braun, S. and Zschenderlein, U. and Heilmann, J. and Pantou, R. and Schacht, R. and Rzepka, R. and Ras, M. Abo and Kurth, S. and Kuhn, H.}, title = {Full-field through-chip IR-thermography-based quality testing \& failure analysis on electroplated aluminium interconnects for cryogenic applications in Ion-trap quantum computers}, series = {2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, journal = {2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, doi = {10.1109/EuroSimE60745.2024.10491500}, pages = {1 -- 8}, abstract = {This paper addresses thermal transient IR thermography as full-field and non-destructive failure analytical technique to determine the bond quality of microelectronic joints, exploiting the transparency of a silicon chip for MIR photons. The method is exemplified for C2C bonded electroplated Aluminium joints as they could come in as a novel joining technology for 3D heterogeneously integrated Cryo-SiP architectures for ion-trap based quantum computers. We have evaluated the method experimentally for different thermo sonic bond parameters and validated it by metallographic sectioning. First results are shown. We could derive that the phase and amplitude image could be used to detect defects in the joints with good sensitivity and within reasonable testing times. This method could have potential to determine zero-hour quality of such joints during inline testing}, language = {en} }