@inproceedings{SchmueckleLenkHutteretal., author = {Schm{\"u}ckle, Franz-Josef and Lenk, Friedrich and Hutter, M. and Klein, M. and Oppermann, H. and Engelmann, G. and Topper, M. and Riepe, K. and Heinrich, Wolfgang}, title = {W-band flip-chip VCO in thin-film environment}, series = {2005 IEEE MTT-S International Microwave Symposium, June 12 - 17, 2005, Long Beach, CA}, booktitle = {2005 IEEE MTT-S International Microwave Symposium, June 12 - 17, 2005, Long Beach, CA}, publisher = {IEEE Operations Center}, address = {Piscataway, NJ}, isbn = {0-7803-8845-3}, doi = {10.1109/MWSYM.2005.1516837}, abstract = {A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs-HBT MMIC is flip-chip-mounted to demonstrate validity of the packaging scheme.}, language = {en} }