@misc{MaiMarschmeyerPeczeketal., author = {Mai, Christian and Marschmeyer, Steffen and Peczek, Anna and Kroh, Aleksandra and Jose, Josmy and Reiter, Sebastian and Fischer, Inga Anita and Wenger, Christian and Mai, Andreas}, title = {Integration Aspects of Plasmonic TiN-based Nano-Hole-Arrays on Ge Photodetectorsin a 200mm Wafer CMOS Compatible Silicon Technology}, series = {ECS Transactions}, volume = {109}, journal = {ECS Transactions}, number = {4}, issn = {1938-5862}, doi = {10.1149/10904.0035ecst}, pages = {35 -- 46}, abstract = {In this work we present the progress in regard to the integration of a surface plasmon resonance refractive index sensor into a CMOS compatible 200 mm wafer silicon-based technology. Our approach pursues the combination of germanium photodetectors with metallic nanohole arrays. The paper is focused on the technology development to fabricate large area photodetectors based on a modern design concept. In a first iteration we achieved a leakage current density of 82 mA/cm2 at reverse bias of 0.5 V and a maximum optical responsivity of 0.103 A/W measured with TE polarized light at λ = 1310 nm and a reversed bias of 1 V. For the realization of nanohole arrays we used thin Titanium nitride (TiN) layers deposited by a sputtering process. We were able to produce very homogenous TiN layers with a thickness deviation of around 10 \% and RMS of 1.413 nm for 150 nm thick TiN layers.}, language = {en} } @misc{HanReiterSchlipfetal., author = {Han, Weijia and Reiter, Sebastian and Schlipf, Jon and Mai, Christian and Spirito, Davide and Jose, Josmy and Wenger, Christian and Fischer, Inga Anita}, title = {Strongly enhanced sensitivities of CMOS compatible plasmonic titanium nitride nanohole arrays for refractive index sensing under oblique incidence}, series = {Optics Express}, volume = {31}, journal = {Optics Express}, number = {11}, issn = {1094-4087}, doi = {10.1364/OE.481993}, pages = {17389 -- 17407}, abstract = {Titanium nitride (TiN) is a complementary metal-oxide-semiconductor (CMOS) compatible material with large potential for the fabrication of plasmonic structures suited for device integration. However, the comparatively large optical losses can be detrimental for application. This work reports a CMOS compatible TiN nanohole array (NHA) on top of a multilayer stack for potential use in integrated refractive index sensing with high sensitivities at wavelengths between 800 and 1500 nm. The stack, consisting of the TiN NHA on a silicon dioxide (SiO2) layer with Si as substrate (TiN NHA/SiO2/Si), is prepared using an industrial CMOS compatible process. The TiN NHA/SiO2/Si shows Fano resonances in reflectance spectra under oblique excitation, which are well reproduced by simulation using both finite difference time domain (FDTD) and rigorous coupled-wave analysis (RCWA) methods. The sensitivities derived from spectroscopic characterizations increase with the increasing incident angle and match well with the simulated sensitivities. Our systematic simulation-based investigation of the sensitivity of the TiN NHA/SiO2/Si stack under varied conditions reveals that very large sensitivities up to 2305 nm per refractive index unit (nm RIU-1) are predicted when the refractive index of superstrate is similar to that of the SiO2 layer. We analyze in detail how the interplay between plasmonic and photonic resonances such as surface plasmon polaritons (SPPs), localized surface plasmon resonances (LSPRs), Rayleigh Anomalies (RAs), and photonic microcavity modes (Fabry-P{\´e}rot resonances) contributes to this result. This work not only reveals the tunability of TiN nanostructures for plasmonic applications but also paves the way to explore efficient devices for sensing in broad conditions.}, language = {en} } @misc{ReiterHanMaietal., author = {Reiter, Sebastian and Han, Weijia and Mai, Christian and Spirito, Davide and Jose, Josmy and Z{\"o}llner, Marvin Hartwig and Fursenko, Oksana and Schubert, Markus Andreas and Stemmler, Ivo and Wenger, Christian and Fischer, Inga Anita}, title = {Titanium Nitride Plasmonic Nanohole Arrays for CMOS-Compatible Integrated Refractive Index Sensing: Influence of Layer Thickness on Optical Properties}, series = {Plasmonics}, journal = {Plasmonics}, issn = {1557-1963}, doi = {10.1007/s11468-023-01810-3}, pages = {1 -- 13}, language = {en} } @misc{PrillSinghSeeberetal., author = {Prill, Robert and Singh, Jasvinder A. and Seeber, Gesine H. and Mai Nielsen, Sabrina and Goodman, Susan and Michel, Sven and Kopkow, Christian and Schulz, Robert and Choong, Peter and Hommel, Hagen}, title = {Patient, physiotherapist and surgeon endorsement of the core domain set for total hip and total knee replacement in Germany: a study protocol for an OMERACT initiative}, series = {BMJ open}, volume = {10}, journal = {BMJ open}, number = {6}, issn = {2044-6055}, doi = {10.1136/bmjopen-2019-035207}, pages = {8}, language = {en} } @misc{MahadevaiahPerezLiskeretal., author = {Mahadevaiah, Mamathamba Kalishettyhalli and Perez, Eduardo and Lisker, Marco and Schubert, Markus Andreas and Perez-Bosch Quesada, Emilio and Wenger, Christian and Mai, Andreas}, title = {Modulating the Filamentary-Based Resistive Switching Properties of HfO2 Memristive Devices by Adding Al2O3 Layers}, series = {Electronics : open access journal}, volume = {11}, journal = {Electronics : open access journal}, number = {10}, issn = {2079-9292}, doi = {10.3390/electronics11101540}, pages = {14}, abstract = {The resistive switching properties of HfO2 based 1T-1R memristive devices are electrically modified by adding ultra-thin layers of Al2O3 into the memristive device. Three different types of memristive stacks are fabricated in the 130 nm CMOS technology of IHP. The switching properties of the memristive devices are discussed with respect to forming voltages, low resistance state and high resistance state characteristics and their variabilities. The experimental I-V characteristics of set and reset operations are evaluated by using the quantum point contact model. The properties of the conduction filament in the on and off states of the memristive devices are discussed with respect to the model parameters obtained from the QPC fit.}, language = {en} } @misc{LukosiusLukoseLiskeretal., author = {Lukosius, Mindaugas and Lukose, Rasuolė and Lisker, Marco and Dubey, P. K. and Raju, A. I. and Capista, Daniele and Majnoon, Farnaz and Mai, A. and Wenger, Christian}, title = {Developments of Graphene devices in 200 mm CMOS pilot line}, series = {Proc. Nanotechnology Materials and Devices Conference (NMDC 2023),Paestum, Italy, 22-25 October 2023}, journal = {Proc. Nanotechnology Materials and Devices Conference (NMDC 2023),Paestum, Italy, 22-25 October 2023}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, isbn = {979-8-3503-3546-0}, doi = {10.1109/NMDC57951.2023.10343569}, pages = {505 -- 506}, abstract = {Due to the unique electronic band structure, graphene has opened great potential to extend the functionality of a large variety of devices. Despite the significant progress in the fabrication of various graphene based microelectronic devices, the integration of graphene devices still lack the stability and compatibility with Si-technology processes. Therefore, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance. This study aims to explore various aspects of graphene research on a 200mm pilot line, with a focus on simulations and fabrication of graphene modulator. To be more precise, it includes design and fabrication of the layouts, necessary mask sets, creation of the flows, fabrication, and measurements of the Gr modulators on 200 mm wafers.}, language = {en} } @misc{PrillSinghSeeberetal., author = {Prill, Robert and Singh, Jasvinder A. and Seeber, Gesine H. and Mai Nielsen, Sabrina and Goodman, Susan and Michel, Sven and Kopkow, Christian and Schulz, Robert and Choong, Peter and Hommel, Hagen}, title = {Endorsement des OMERACT Core Domain Sets f{\"u}r H{\"u}ft- und Kniegelenkersatz: ein Survey unter Patienten, Physiotherapeuten und Orthop{\"a}den in Deutschland - ein Studienprotokoll}, series = {4. Forschungssymposium Physiotherapie, FSPT2019 Abstractband}, journal = {4. Forschungssymposium Physiotherapie, FSPT2019 Abstractband}, pages = {45 -- 46}, language = {de} } @misc{LukosiusLukoseLiskeretal., author = {Lukosius, Mindaugas and Lukose, Rasuolė and Lisker, Marco and Luongo, G. and Elviretti, M. and Mai, Andreas and Wenger, Christian}, title = {Graphene Research in 200 mm CMOS Pilot Line}, series = {45th Jubilee International Convention on Information, Communication and Electronic Technology (MIPRO), 2022}, journal = {45th Jubilee International Convention on Information, Communication and Electronic Technology (MIPRO), 2022}, isbn = {978-953-233-103-5}, issn = {2623-8764}, doi = {10.23919/MIPRO55190.2022.9803362}, pages = {113 -- 117}, abstract = {Due to the unique electronic structures, graphene and other 2D Materials are considered as materials which can enable and extend the functionalities and performance in a large variety of applications, among them in microelectronics. At this point, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance.Towards these goals, this paper focuses on the full spectra of graphene research aspects in 200mm pilot line. We investigated different process module developments such as CMOS compatible growth of high quality graphene on germanium and its growth mechanisms, transfer related challenges on target substrates, patterning, passivation and various concepts of contacting of graphene on a full 200 mm wafers. Finally, we fabricated proof-of-concept test structures e.g. TLM, Hall bars and capacitor structures to prove the feasibility of graphene processing in the pilot line of IHP.}, language = {en} } @misc{PechmannMaiVoelkeletal., author = {Pechmann, Stefan and Mai, Timo and V{\"o}lkel, Matthias and Mahadevaiah, Mamathamba Kalishettyhalli and Perez, Eduardo and Perez-Bosch Quesada, Emilio and Reichenbach, Marc and Wenger, Christian and Hagelauer, Amelie}, title = {A Versatile, Voltage-Pulse Based Read and Programming Circuit for Multi-Level RRAM Cells}, series = {Electronics}, volume = {10}, journal = {Electronics}, number = {5}, issn = {2079-9292}, doi = {10.3390/electronics10050530}, pages = {17}, abstract = {In this work, we present an integrated read and programming circuit for Resistive Random Access Memory (RRAM) cells. Since there are a lot of different RRAM technologies in research and the process variations of this new memory technology often spread over a wide range of electrical properties, the proposed circuit focuses on versatility in order to be adaptable to different cell properties. The circuit is suitable for both read and programming operations based on voltage pulses of flexible length and height. The implemented read method is based on evaluating the voltage drop over a measurement resistor and can distinguish up to eight different states, which are coded in binary, thereby realizing a digitization of the analog memory value. The circuit was fabricated in the 130 nm CMOS process line of IHP. The simulations were done using a physics-based, multi-level RRAM model. The measurement results prove the functionality of the read circuit and the programming system and demonstrate that the read system can distinguish up to eight different states with an overall resistance ratio of 7.9.}, language = {en} }