@misc{MaiMarschmeyerPeczeketal., author = {Mai, Christian and Marschmeyer, Steffen and Peczek, Anna and Kroh, Aleksandra and Jose, Josmy and Reiter, Sebastian and Fischer, Inga Anita and Wenger, Christian and Mai, Andreas}, title = {Integration Aspects of Plasmonic TiN-based Nano-Hole-Arrays on Ge Photodetectorsin a 200mm Wafer CMOS Compatible Silicon Technology}, series = {ECS Transactions}, volume = {109}, journal = {ECS Transactions}, number = {4}, issn = {1938-5862}, doi = {10.1149/10904.0035ecst}, pages = {35 -- 46}, abstract = {In this work we present the progress in regard to the integration of a surface plasmon resonance refractive index sensor into a CMOS compatible 200 mm wafer silicon-based technology. Our approach pursues the combination of germanium photodetectors with metallic nanohole arrays. The paper is focused on the technology development to fabricate large area photodetectors based on a modern design concept. In a first iteration we achieved a leakage current density of 82 mA/cm2 at reverse bias of 0.5 V and a maximum optical responsivity of 0.103 A/W measured with TE polarized light at λ = 1310 nm and a reversed bias of 1 V. For the realization of nanohole arrays we used thin Titanium nitride (TiN) layers deposited by a sputtering process. We were able to produce very homogenous TiN layers with a thickness deviation of around 10 \% and RMS of 1.413 nm for 150 nm thick TiN layers.}, language = {en} } @misc{MahadevaiahPerezLiskeretal., author = {Mahadevaiah, Mamathamba Kalishettyhalli and P{\´e}rez, Eduardo and Lisker, Marco and Schubert, Markus Andreas and Perez-Bosch Quesada, Emilio and Wenger, Christian and Mai, Andreas}, title = {Modulating the Filamentary-Based Resistive Switching Properties of HfO2 Memristive Devices by Adding Al2O3 Layers}, series = {Electronics : open access journal}, volume = {11}, journal = {Electronics : open access journal}, number = {10}, issn = {2079-9292}, doi = {10.3390/electronics11101540}, pages = {14}, abstract = {The resistive switching properties of HfO2 based 1T-1R memristive devices are electrically modified by adding ultra-thin layers of Al2O3 into the memristive device. Three different types of memristive stacks are fabricated in the 130 nm CMOS technology of IHP. The switching properties of the memristive devices are discussed with respect to forming voltages, low resistance state and high resistance state characteristics and their variabilities. The experimental I-V characteristics of set and reset operations are evaluated by using the quantum point contact model. The properties of the conduction filament in the on and off states of the memristive devices are discussed with respect to the model parameters obtained from the QPC fit.}, language = {en} } @misc{LukosiusLukoseLiskeretal., author = {Lukosius, Mindaugas and Lukose, Rasuolė and Lisker, Marco and Luongo, G. and Elviretti, M. and Mai, Andreas and Wenger, Christian}, title = {Graphene Research in 200 mm CMOS Pilot Line}, series = {45th Jubilee International Convention on Information, Communication and Electronic Technology (MIPRO), 2022}, journal = {45th Jubilee International Convention on Information, Communication and Electronic Technology (MIPRO), 2022}, isbn = {978-953-233-103-5}, issn = {2623-8764}, doi = {10.23919/MIPRO55190.2022.9803362}, pages = {113 -- 117}, abstract = {Due to the unique electronic structures, graphene and other 2D Materials are considered as materials which can enable and extend the functionalities and performance in a large variety of applications, among them in microelectronics. At this point, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance.Towards these goals, this paper focuses on the full spectra of graphene research aspects in 200mm pilot line. We investigated different process module developments such as CMOS compatible growth of high quality graphene on germanium and its growth mechanisms, transfer related challenges on target substrates, patterning, passivation and various concepts of contacting of graphene on a full 200 mm wafers. Finally, we fabricated proof-of-concept test structures e.g. TLM, Hall bars and capacitor structures to prove the feasibility of graphene processing in the pilot line of IHP.}, language = {en} }