@misc{WunderleMayCirulisetal., author = {Wunderle, B. and May, D. and Cirulis, I. and Braun, S. and Zschenderlein, U. and Heilmann, J. and T{\"u}rk, P. and Pantou, R. and Schacht, R. and Rzepka, R. and Ras, M. Abo and Kurth, S. and Kuhn, H.}, title = {Full-field IR-thermography for bond-quality inspection of electroplated aluminium interconnects for Cryo-SiP architectures}, series = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)}, journal = {2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)}, publisher = {IEEE}, doi = {10.1109/ESTC60143.2024.10712030}, pages = {1 -- 9}, abstract = {This paper addresses thermal transient IR thermography as full-field and non-destructive failure analytical technique to determine the bond quality of microelectronic joints, exploiting the transparency of a silicon chip for MIR photons. The method is exemplified for C2C bonded electroplated Aluminium joints as they could come in as a novel joining technology for 3D heterogeneously integrated Cryo-SiP architectures for ion-trap based quantum computers. We have evaluated the method experimentally for different thermosonic bond parameters and validated it by metallographic sectioning. First results are shown. We could derive that the phase and amplitude image could be used to detect defects in the joints with good sensitivity and within reasonable testing times. This method could have potential to determine zero-hour quality of such joints during inline testing.}, language = {en} } @misc{MayWunderleCirulisetal., author = {May, D. and Wunderle, B. and Cirulis, I. and Braun, S. and Zschenderlein, U. and Heilmann, J. and Pantou, R. and Schacht, R. and Rzepka, R. and Ras, M. Abo and Kurth, S. and Kuhn, H.}, title = {Full-field through-chip IR-thermography-based quality testing \& failure analysis on electroplated aluminium interconnects for cryogenic applications in Ion-trap quantum computers}, series = {2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, journal = {2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, publisher = {IEEE}, doi = {10.1109/EuroSimE60745.2024.10491500}, pages = {1 -- 8}, abstract = {This paper addresses thermal transient IR thermography as full-field and non-destructive failure analytical technique to determine the bond quality of microelectronic joints, exploiting the transparency of a silicon chip for MIR photons. The method is exemplified for C2C bonded electroplated Aluminium joints as they could come in as a novel joining technology for 3D heterogeneously integrated Cryo-SiP architectures for ion-trap based quantum computers. We have evaluated the method experimentally for different thermo sonic bond parameters and validated it by metallographic sectioning. First results are shown. We could derive that the phase and amplitude image could be used to detect defects in the joints with good sensitivity and within reasonable testing times. This method could have potential to determine zero-hour quality of such joints during inline testing}, language = {en} } @misc{WaegeleBodesheimBourlatetal., author = {W{\"a}gele, J. Wolfgang and Bodesheim, Paul and Bourlat, Sarah J. and Denzler, Joachim and Diepenbroek, Michael and Fonseca, Vera and Frommolt, Karl-Heinz and Geiger, Matthias F. and Gemeinholzer, Birgit and Gl{\"o}ckner, Frank Oliver and Haucke, Timm and Kirse, Ameli and K{\"o}lpin, Alexander and Kostadinov, Ivaylo and K{\"u}hl, Hjalmar S. and Kurth, Frank and Lasseck, Mario and Liedke, Sascha and Losch, Florian and M{\"u}ller, Sandra and Petrovskaya, Natalia and Piotrowski, Krzysztof and Radig, Bernd and Scherber, Christoph and Schoppmann, Lukas and Schulz, Jan and Steinhage, Volker and Tschan, Georg F. and Vautz, Wolfgang and Velotto, Domenico and Weigend, Maximilian and Wildermann, Stefan}, title = {Towards a Multisensor Station for Automated Biodiversity Monitoring}, series = {Basic and Applied Ecology}, volume = {59}, journal = {Basic and Applied Ecology}, issn = {1439-1791}, doi = {10.1016/j.baae.2022.01.003}, pages = {105 -- 138}, language = {en} } @incollection{UlrichSchlegelMertensetal., author = {Ulrich, Rainer G. and Schlegel, Matthias and Mertens, Marc and Groschup, Martin H. and Schmidt-Chanasit, Jonas and Plenge-B{\"o}nig, Anita and Jacob, Jens and Pelz, Hans-Joachim and Freise, Jona and Wenk, Matthias and Thiel, J{\"o}rg and Triebenbacher, Cornelia and Schmolz, Eric and Kurth, Andreas and Kr{\"u}ger, Frank and R{\"u}he, Ferdinand and Kiffner, Christian and Ansorge, Hermann and Gerwin, Werner and Wegener, Wolfgang and M{\"u}ller, J{\"o}rg and Bemmann, Margit and Wolf, Ronny and Otto, Lutz-Florian and Oehme, Rainer and Pfeffer, Martin and Heckel, Gerald and Schex, Susanne and Essbauer, Sandra S.}, title = {Netzwerk Nagetier-{\"u}bertragene Pathogene: Monitoring von Hantavirus-Infektionen in Deutschland}, series = {Wildhygiene, Wildtierkrankheiten, Parasiten, Epidemiologie}, booktitle = {Wildhygiene, Wildtierkrankheiten, Parasiten, Epidemiologie}, publisher = {Ges. f{\"u}r Wildtier- und Jagdforschung}, address = {Halle/Saale}, isbn = {978-378-88131-2-3}, issn = {1436-3895}, pages = {229 -- 250}, language = {de} }