@misc{SowińskaHenkelSchmeisseretal., author = {Sowińska, Małgorzata and Henkel, Karsten and Schmeißer, Dieter and K{\"a}rkk{\"a}nen, Irina and Schneidewind, Jessica and Naumann, Franziska and Gruska, Bernd and Gargouri, Hassan}, title = {Plasma-enhanced atomic layer deposition of titanium oxynitrides films: A comparative spectroscopic and electrical study}, series = {Journal of Vacuum Science and Technology A}, journal = {Journal of Vacuum Science and Technology A}, number = {34}, issn = {0734-2101}, doi = {10.1116/1.4936227}, pages = {01A127-1 -- 01A127-9}, abstract = {The process parameters' impact of the plasma-enhanced atomic layer deposition (PE-ALD) method on the oxygen to nitrogen (O/N) ratio in titanium oxynitride (TiOxNy) films was studied. Titanium(IV)isopropoxide in combination with NH3 plasma and tetrakis(dimethylamino) titanium by applying N2 plasma processes were investigated. Samples were characterized by the in situ spectroscopic ellipsometry, x-ray photoelectron spectroscopy, and electrical characterization (current-voltage: I-V and capacitance-voltage: C-V) methods. The O/N ratio in the TiOxNy films is found to be very sensitive for their electric properties such as conductivity, dielectric breakdown, and permittivity. Our results indicate that these PE-ALD film properties can be tuned, via the O/N ratio, by the selection of the process parameters and precursor/coreactant combination.}, language = {en} } @inproceedings{TallaridaHenkelGargourietal., author = {Tallarida, Massimo and Henkel, Karsten and Gargouri, Hassan and Haeberle, J{\"o}rg and Gruska, Bernd and Arens, Matthias and Schmeißer, Dieter}, title = {New opportunities with Plasma enhanced atomic layer deposition (PE-ALD) of oxides}, series = {Verhandlungen der Deutschen Physikalischen Gesellschaft}, booktitle = {Verhandlungen der Deutschen Physikalischen Gesellschaft}, publisher = {Deutsche Physikalische Gesellschaft}, address = {Bad Honnef}, issn = {0420-0195}, abstract = {Thermal Atomic layer deposition (T-ALD) of oxides is obtained by the pulsed alternation of a metal precursor and an oxygen source, typically H2O or O3, and the reactions leading to ALD are thermally activated. With plasma enhanced ALD (PE-ALD), instead, the oxygen source is represented by an oxygen-containing plasma. The higher reactivity of the plasma-generated species extend the capabilities of ALD: improved film quality and increased flexibility in process conditions, such as growth at low temperature, are typical advantages of PE-ALD over T-ALD. We report on results on the preparation of thin (<100 nm) aluminum oxide (Al2O3) films on silicon substrates using T-ALD and PE-ALD in the SENTECH SI ALD LL system. Films were deposited in the temperature range between room temperature (RT) and 200∘C. We characterized the films with spectroscopic ellipsometry (thickness, refractive index, growth rate) over 4" wafers and with X-ray photoelectron spectroscopy. All films resulted in a high degree of homogeneity, independent of the deposition temperature. Investigations with capacitance-voltage and conductance-voltage measurements showed a very low interface states density for the PE-ALD films.}, language = {en} } @misc{SowinskaBrizziDasetal., author = {Sowinska, Małgorzata and Brizzi, Simone and Das, Chittaranjan and K{\"a}rkk{\"a}nen, Irina and Schneidewind, Jessica and Naumann, Franziska and Gargouri, Hassan and Henkel, Karsten and Schmeißer, Dieter}, title = {Analysis of nitrogen species in titanium oxynitride ALD films}, series = {Applied Surface Science}, volume = {381}, journal = {Applied Surface Science}, issn = {0169-4332}, doi = {10.1016/j.apsusc.2016.02.096}, pages = {42 -- 47}, abstract = {Titanium oxynitride films are prepared by plasma enhanced atomic layer deposition method using two different precursors and nitrogen sources. Synchrotron radiation-based X-ray photoelectron spectroscopy and X-ray absorption spectroscopy are used to characterize the nitrogen species incorporated within these films depending on the deposition parameters. It is found that nitrogen atoms in these films are differently bonded. In particular, it can be distinguished between Ti-ON and Ti-N bonding configurations and molecular nitrogen species caused by precursor fragments.}, language = {en} } @inproceedings{KotNaumannGarainetal., author = {Kot, Małgorzata and Naumann, Franziska and Garain, Samiran and Po{\'{z}}arowska, Emilia and Gargouri, Hassan and Henkel, Karsten and Schmeißer, Dieter}, title = {Aluminum nitride films prepared by plasma atomic layer deposition using different plasma sources}, series = {Verhandlungen der Deutschen Physikalischen Gesellschaft, Reihe 6, Band 53,3}, booktitle = {Verhandlungen der Deutschen Physikalischen Gesellschaft, Reihe 6, Band 53,3}, publisher = {Deutsche Physikalische Gesellschaft}, address = {Bad Honnef}, issn = {0420-0195}, pages = {S. 170}, abstract = {Aluminum nitride (AlN) thin films are promising for versatile applications in optoelectronics, electronics, piezoelectrics, and acoustics due to their remarkable properties such as wide band gap, high dielectric constant, low electrical conductivity, good piezoelectric coefficient and high ultrasonic velocity. We present a comparative study of AlN films grown by plasma-enhanced atomic layer deposition at 350°C silicon wafers in the SENTECH SI ALD LL system using TMA and NH3 where either a capacitively coupled plasma (CCP) or a direct PTSA (planar triple spiral antenna) source was applied. The films were characterized by ellipsometry, XPS and electrical measurements. The layer properties are discussed concerning the varied ALD process parameters. In general, the process using the direct PTSA source delivered films with higher refractive index and better homogeneity over the wafer achieving also higher growth rates per cycle (GPC) in reduced total cycle durations. Films with refractive index in the range of 2.05 and permittivity around 8 could be realized with a GPC of 1.54 {\AA}/cycle.}, language = {en} } @misc{NaumannReckGargourietal., author = {Naumann, Franziska and Reck, Johanna and Gargouri, Hassan and Gruska, Bernd and Bl{\"u}mich, Adrian and Mahmoodinezhad, Ali and Janowitz, Christoph and Henkel, Karsten and Flege, Jan Ingo}, title = {In situ real-time and ex situ spectroscopic analysis of Al₂O₃ films prepared by plasma enhanced atomic layer deposition}, series = {Journal of Vacuum Science and Technology B}, volume = {38}, journal = {Journal of Vacuum Science and Technology B}, number = {1}, issn = {0734-211X}, doi = {10.1116/1.5122797}, pages = {10}, abstract = {In situ real-time ellipsometry (irtE) with a very high time resolution of 24 ms was applied to monitor the inductively coupled plasma enhanced atomic layer deposition (ALD) process of Al₂O₃ thin films to precisely resolve each step of the ALD process and its complete cycle. The influence of plasma power, plasma pulse duration, and deposition temperature on the film growth characteristics was investigated. Ex situ ellipsometry [UV-VIS-NIR-SE (ultraviolet-visible-nearinfrared-spectroscopic ellipsometry) and IR-SE (infrared spectroscopic ellipsometry)] and x-ray photoelectron spectroscopy revealed the bulk properties (thickness, refractive index, chemical composition, and carbon incorporation) of the films, which together with the in situ results are compared to those of the films prepared by thermal ALD (T-ALD). The ICPEALD (inductively coupled plasma enhanced ALD) films were deposited at substrate temperatures between 80 and 250 °C and the role of plasma power (50-300 W) and its pulse duration (1-20 s) was investigated at 250 °C. The reference T-ALD layers were prepared at 200 °C. The ICPEALD process of Al₂O₃ shows an increased growth rate, and the produced films exhibit higher carbon contaminations than the T-ALD Al₂O₃ films. Plasma pulse times of up to 15 s further increase the content of carbon and CH species; at the same time, the refractive index decreases. The optical properties of ICPEALD deposited Al₂O₃ films are comparable with those of the T-ALD films for low plasma power and short plasma pulse durations. For the ICPEALD films, UV absorption is found and it is dependent on the deposition parameters. irtE resolves process effects that correlate with the bulk properties of Al₂O₃, such as impurities and oxygen deficiencies.}, language = {en} } @misc{JanowitzMahmoodinezhadNaumannetal., author = {Janowitz, Christoph and Mahmoodinezhad, Ali and Naumann, Franziska and Plate, Paul and Henkel, Karsten and Flege, Jan Ingo}, title = {XPS and UPS investigation of an ALD prepared Al2O3/ZnO heterojunction}, series = {Verhandlungen der DPG - SurfaceScience21}, volume = {2021}, journal = {Verhandlungen der DPG - SurfaceScience21}, publisher = {Deutsche Physikalische Gesellschaft e.V.}, address = {Bad Honnef}, abstract = {The band alignment of two large band gap oxides was studied by a combination of XPS and UPS using consecutive sputter steps to unravel the electronic structure and elemental composition of each layer and the interface region. An Al2O3/ZnO heterointerface (10 nm Al2O3 on 59 nm ZnO) was grown on top of a Si single crystal substrate by consecutive thermal and plasma-assisted atomic layer deposition (ALD) respectively. The valence band maximum of Al2O3 was found to be 1.1 eV below that of ZnO, the conduction band minimum 2.3 eV above, resulting in a type-I staggered heterojunction. A reduction of ZnO to elemental Zn in the interface region was detected by the apparent shoulder of the Zn 2p and 2s core levels and by the Zn LMM Auger. This suggests an ALD interface formation mechanism different from previous models identified for other heterointerfaces.}, language = {en} } @misc{MahmoodinezhadMoralesNaumannetal., author = {Mahmoodinezhad, Ali and Morales, Carlos and Naumann, Franziska and Plate, Paul and Meyer, Robert and Janowitz, Christoph and Henkel, Karsten and Kot, Małgorzata and Flege, Jan Ingo}, title = {Low-temperature atomic layer deposition of indium oxide thin films using trimethylindium and oxygen plasma}, series = {Verhandlungen der DPG - SurfaceScience21}, volume = {2021}, journal = {Verhandlungen der DPG - SurfaceScience21}, publisher = {Deutsche Physikalische Gesellschaft e.V.}, address = {Bad Honnef}, abstract = {Indium oxide thin films were deposited on Si (100) by plasma-enhanced atomic layer deposition (PEALD) using trimethylindium (TMIn) and oxygen plasma (O2) in a low-temperature range of 80 to 200 °C. The In2O3 layers were characterized by in-situ spectroscopic ellipsometry (SE), ex-situ X-ray photoelectron spectroscopy (XPS) and electrical measurements. The SE data show a growth rate of 0.56 {\AA}/cycle within the ALD window (100 to 150 °C) with a thickness inhomogeneity of ≤1.2\%. In addition, the highest refractive index is 2.07 (at 632.8 nm) for the layer grown at 150 °C, and the films exhibit indirect and direct band gaps of 2.8±0.1 eV and 3.3±0.2 eV, respectively. XPS characterization indicates no carbon incorporation and a temperature-dependent off-stoichiometry of the layers. The chemical analysis of the In 3d and O 1s core levels confirms the formation of In-O bonds and suggests the additional presence of hydroxyl groups and defects. With increasing temperature, the contribution of OH groups and defects decreases whereas that of In-O bonds increases. Notably, higher growth temperatures result in an indium rich phase within the layers.}, language = {en} } @misc{MahmoodinezhadMoralesNaumannetal., author = {Mahmoodinezhad, Ali and Morales, Carlos and Naumann, Franziska and Plate, Paul and Meyer, Robert and Janowitz, Christoph and Henkel, Karsten and Kot, Małgorzata and Z{\"o}llner, Marvin Hartwig and Wenger, Christian and Flege, Jan Ingo}, title = {Low-temperature atomic layer deposition of indium oxide thin films using trimethylindium and oxygen plasma}, series = {Journal of Vacuum Science and Technology A}, volume = {39}, journal = {Journal of Vacuum Science and Technology A}, number = {6}, issn = {0734-2101}, doi = {10.1116/6.0001375}, abstract = {Indium oxide (InxOy) thin films were deposited by plasma-enhanced atomic layer deposition (PEALD) using trimethylindium and oxygen plasma in a low-temperature range of 80-200 °C. The optical properties, chemical composition, crystallographic structure, and electrical characteristics of these layers were investigated by spectroscopic ellipsometry (SE), x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), as well as current-voltage and capacitance-voltage measurements. The SE results yielded a nearly constant growth rate of 0.56 {\AA} per cycle and a thickness inhomogeneity of ≤1.2\% across 4-in. substrates in the temperature range of 100-150 °C. The refractive index (at 632.8 nm) was found to be 2.07 for the films deposited at 150 °C. The PEALD-InxOy layers exhibit a direct (3.3 ± 0.2 eV) and an indirect (2.8 ± 0.1 eV) bandgap with an uptrend for both with increasing substrate temperature. Based on XPS characterization, all InxOy samples are free of carbon impurities and show a temperature-dependent off-stoichiometry indicating oxygen vacancies. XRD diffraction patterns demonstrate an onset of crystallization at 150 °C. Consistent with the optical, XPS, and XRD data, the films deposited at ≥150 °C possess higher electrical conductivity. Our findings prove that a low-temperature PEALD process of InxOy is feasible and promising for a high-quality thin-film deposition without chemical impurities on thermally fragile substrates.}, language = {en} } @misc{MahmoodinezhadMoralesKotetal., author = {Mahmoodinezhad, Ali and Morales, Carlos and Kot, Małgorzata and Naumann, Franziska and Plate, Paul and Henkel, Karsten and Flege, Jan Ingo}, title = {A super-cycle approach to atomic layer deposition of indium-gallium-zinc oxide at low temperature}, series = {Verhandlungen der DPG}, journal = {Verhandlungen der DPG}, publisher = {Deutsche Physikalische Gesellschaft}, address = {Bad Honnef}, issn = {0420-0195}, abstract = {The continuing development of multifunctional devices needs novel multicomponent oxide layers, demanding a high control of both composition and thickness during their preparation. To this end, single metal oxides exhibiting high structural quality and conformity have successfully been grown by atomic layer deposition (ALD). However, the deposition of more complex compounds with specific optical and electrical properties is still challenging. In this work, we follow a bottom-up approach to design an ALD super-cycle to grow mixed indium-gallium-zinc oxide (IGZO) films with a controllable composition. For the formation of the individual indium, gallium, and zinc oxides, we found the use of plasma-enhanced ALD (PEALD) at 150 °C to be favorable when using the organometallic precursors trimethylindium, trimethylgallium, and diethylzinc together with oxygen plasma. The PEALD approach of IGZO films can particularly overcome a nucleation delay within the ZnO sub-cycle known from thermal ALD, achieving a higher growth per cycle and improving the quality and composition homogeneity of the films as shown by in-situ spectroscopic ellipsometry and ex-situ X-ray photoelectron spectroscopy.}, language = {en} } @misc{MoralesMahmoodinezhadTschammeretal., author = {Morales, Carlos and Mahmoodinezhad, Ali and Tschammer, Rudi and Kosto, Yuliia and Alvarado Chavarin, Carlos and Schubert, Markus Andreas and Wenger, Christian and Henkel, Karsten and Flege, Jan Ingo}, title = {Combination of Multiple Operando and In-Situ Characterization Techniques in a Single Cluster System for Atomic Layer Deposition: Unraveling the Early Stages of Growth of Ultrathin Al2O3 Films on Metallic Ti Substrates}, series = {Inorganics}, volume = {11}, journal = {Inorganics}, number = {12}, issn = {2304-6740}, doi = {10.3390/inorganics11120477}, abstract = {This work presents a new ultra-high vacuum cluster tool to perform systematic studies of the early growth stages of atomic layer deposited (ALD) ultrathin films following a surface science approach. By combining operando (spectroscopic ellipsometry and quadrupole mass spectrometry) and in situ (X-ray photoelectron spectroscopy) characterization techniques, the cluster allows us to follow the evolution of substrate, film, and reaction intermediates as a function of the total number of ALD cycles, as well as perform a constant diagnosis and evaluation of the ALD process, detecting possible malfunctions that could affect the growth, reproducibility, and conclusions derived from data analysis. The homemade ALD reactor allows the use of multiple precursors and oxidants and its operation under pump and flow-type modes. To illustrate our experimental approach, we revisit the well-known thermal ALD growth of Al2O3 using trimethylaluminum and water. We deeply discuss the role of the metallic Ti thin film substrate at room temperature and 200 °C, highlighting the differences between the heterodeposition (<10 cycles) and the homodeposition (>10 cycles) growth regimes at both conditions. This surface science approach will benefit our understanding of the ALD process, paving the way toward more efficient and controllable manufacturing processes.}, language = {en} }