@misc{ZschechHoSchmeisseretal., author = {Zschech, Ehrenfried and Ho, O. S. and Schmeißer, Dieter and Meyer, Moritz Andreas and Vairagar, A. V. and Schneider, G. and Hauschildt, Meike and Kraatz, Matthias and Sukharev, V.}, title = {Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation}, series = {IEEE Transactions on Device and Materials Reliability}, volume = {9}, journal = {IEEE Transactions on Device and Materials Reliability}, number = {1}, issn = {1530-4388}, pages = {20 -- 30}, language = {en} } @misc{HoZschechSchmeisseretal., author = {Ho, Paul S. and Zschech, Ehrenfried and Schmeißer, Dieter and Meyer, Moritz Andreas and Huebner, Rene and Hauschildt, Meike and Zhang, Lijuan and Gall, Martin and Kraatz, Matthias}, title = {Scaling effects on microstructure and reliability for cu interconnects}, language = {en} }