@article{ZschechKutukova, author = {Zschech, Ehrenfried and Kutukova, Kristina}, title = {Imaging of microcrack propagation in 3D nanostructures applying laboratory nano-XCT}, series = {Practical metallography}, volume = {61}, journal = {Practical metallography}, number = {11}, publisher = {Walter de Gruyter GmbH}, address = {Berlin}, issn = {2195-8599}, doi = {10.1515/pm-2024-0074}, pages = {829 -- 847}, abstract = {Laboratory X-ray microscopy and nano X-ray computed tomography (nano-XCT) have the unique capability to combine sub-100nm resolution and high object penetration. Therefore, these are appropriate non-destructive inspection techniques for the detection of flaws with a size of 100 nm and below in opaque objects and bulk materials. Another advantage of X-ray microscopy - as opposed to destructive failure analysis methods - is that kinetic processes such as microcrack evolution can be imaged. The unique combination of micromechanics and high-resolution 3D imaging allows to study degradation and failure mechanisms in opaque 3D nanopatterned structures, and it allows to provide essential information for fracture mechanics in small dimensions. The high-resolution in-situ/operando imaging of microcrack propagation in microelectronic products and in battery electrodes is demonstrated.}, language = {en} } @incollection{Zschech, author = {Zschech, Ehrenfried}, title = {Nano NDE with X-rays}, series = {Handbook of Nondestructive Evaluation 4.0}, booktitle = {Handbook of Nondestructive Evaluation 4.0}, editor = {Norbert, Meyendorf and Nathan, Ida and Ripi, Singh and Johannes, Vrana}, publisher = {Springer Nature Switzerland}, address = {Cham}, isbn = {978-3-030-48200-8}, doi = {10.1007/978-3-030-48200-8_69-3}, pages = {1 -- 24}, abstract = {NDT techniques are being pushed to detect smaller and smaller defects in materials and high-tech products that are fabricated using nanotechnologies. The term "nano-NDE" describes the application of NDT techniques with a spatial resolution of 100 nm or better to detect early imperfections and to locate small-scale flaws in materials and components. To evaluate the consequences of sub-μm defects to reliability and lifetime of a product, local materials parameters have to be determined quantitatively. For these tasks, characterization techniques must be developed further or newly established. Since semiconductor industry is a major technology driver, the first broad application of "nano-NDE" is expected in this branch. Metrology, defect inspection, and failure analysis in semiconductor manufacturing use already "nano-NDE" techniques, however, further technique and tool developments are urgently needed for the nondestructive localization of buried sub-μm defects and for fault isolation in 3D-stacked microchips manufactured using advanced packaging technologies such as wafer-level hybrid bonding. "Nano-NDE" is expected to be introduced to a much broader field of applications, particularly for the inspection of small-scale defects in high-value high-tech products and in safety-critical components. Since X-ray microscopy and nano X-ray computed tomography (nano-XCT) have the unique capability to combine sub-100 nm resolution and high object penetration, these are appropriate inspection techniques for the detection of flaws with a size of 100 nm and below in bulk materials, and therefore, they have a high potential for application in "nano-NDE." The high-resolution imaging of micro-voids and of microcracks in microelectronic products is demonstrated.}, language = {en} }