@misc{MahadevaiahPerezLiskeretal., author = {Mahadevaiah, Mamathamba Kalishettyhalli and Perez, Eduardo and Lisker, Marco and Schubert, Markus Andreas and Perez-Bosch Quesada, Emilio and Wenger, Christian and Mai, Andreas}, title = {Modulating the Filamentary-Based Resistive Switching Properties of HfO2 Memristive Devices by Adding Al2O3 Layers}, series = {Electronics : open access journal}, volume = {11}, journal = {Electronics : open access journal}, number = {10}, issn = {2079-9292}, doi = {10.3390/electronics11101540}, pages = {14}, abstract = {The resistive switching properties of HfO2 based 1T-1R memristive devices are electrically modified by adding ultra-thin layers of Al2O3 into the memristive device. Three different types of memristive stacks are fabricated in the 130 nm CMOS technology of IHP. The switching properties of the memristive devices are discussed with respect to forming voltages, low resistance state and high resistance state characteristics and their variabilities. The experimental I-V characteristics of set and reset operations are evaluated by using the quantum point contact model. The properties of the conduction filament in the on and off states of the memristive devices are discussed with respect to the model parameters obtained from the QPC fit.}, language = {en} } @misc{WenBaroniPerezetal., author = {Wen, Jianan and Baroni, Andrea and Perez, Eduardo and Ulbricht, Markus and Wenger, Christian and Krstic, Milos}, title = {Evaluating Read Disturb Effect on RRAM based AI Accelerator with Multilevel States and Input Voltages}, series = {2022 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)}, journal = {2022 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT)}, isbn = {978-1-6654-5938-9}, issn = {2765-933X}, doi = {10.1109/DFT56152.2022.9962345}, pages = {1 -- 6}, abstract = {RRAM technology is a promising candidate for implementing efficient AI accelerators with extensive multiply-accumulate operations. By scaling RRAM devices to the synaptic crossbar array, the computations can be realized in situ, avoiding frequent weights transfer between the processing units and memory. Besides, as the computations are conducted in the analog domain with high flexibility, applying multilevel input voltages to the RRAM devices with multilevel conductance states enhances the computational efficiency further. However, several non-idealities existing in emerging RRAM technology may degrade the reliability of the system. In this paper, we measured and investigated the impact of read disturb on RRAM devices with different input voltages, which incurs conductance drifts and introduces errors. The measured data are deployed to simulate the RRAM based AI inference engines with multilevel states.}, language = {en} } @misc{AkhtarDabrowskiLukoseetal., author = {Akhtar, Fatima and Dabrowski, Jaroslaw and Lukose, Rasuole and Wenger, Christian and Lukosius, Mindaugas}, title = {Chemical Vapor Deposition Growth of Graphene on 200 mm Ge (110)/Si Wafers and Ab Initio Analysis of Differences in Growth Mechanisms on Ge (110) and Ge (001)}, series = {ACS Applied Materials \& Interfaces}, volume = {15}, journal = {ACS Applied Materials \& Interfaces}, number = {30}, issn = {1944-8244}, doi = {10.1021/acsami.3c05860}, pages = {36966 -- 36974}, abstract = {For the fabrication of modern graphene devices, uniform growth of high-quality monolayer graphene on wafer scale is important. This work reports on the growth of large-scale graphene on semiconducting 8 inch Ge(110)/Si wafers by chemical vapor deposition and a DFT analysis of the growth process. Good graphene quality is indicated by the small FWHM (32 cm-1) of the Raman 2D band, low intensity ratio of the Raman D and G bands (0.06), and homogeneous SEM images and is confirmed by Hall measurements: high mobility (2700 cm2/Vs) and low sheet resistance (800 Ω/sq). In contrast to Ge(001), Ge(110) does not undergo faceting during the growth. We argue that Ge(001) roughens as a result of vacancy accumulation at pinned steps, easy motion of bonded graphene edges across (107) facets, and low energy cost to expand Ge area by surface vicinals, but on Ge(110), these mechanisms do not work due to different surface geometries and complex reconstruction.}, language = {en} } @misc{RizziBaroniGlukhovetal., author = {Rizzi, Tommaso and Baroni, Andrea and Glukhov, Artem and Bertozzi, Davide and Wenger, Christian and Ielmini, Daniele and Zambelli, Cristian}, title = {Process-Voltage-Temperature Variations Assessment in Energy-Aware Resistive RAM-Based FPGAs}, series = {IEEE Transactions on Device and Materials Reliability}, volume = {23}, journal = {IEEE Transactions on Device and Materials Reliability}, number = {3}, issn = {1530-4388}, doi = {10.1109/TDMR.2023.3259015}, pages = {328 -- 336}, abstract = {Resistive Random Access Memory (RRAM) technology holds promises to improve the Field Programmable Gate Array (FPGA) performance, reduce the area footprint, and dramatically lower run-time energy requirements compared to the state-of-the-art CMOS-based products. However, the integration of RRAM in FPGAs is hindered by the high programming power consumption and by non-ideal behaviors of the device due to its stochastic nature that may overshadow the benefits in normal operation mode. To cope with these challenges, optimized programming strategies have to be investigated. In this work, we explore the impact that different procedures to set the device have on the run-time performance. Process, voltage, and temperature (PVT) variations as well as time-dependent drift effect of the RRAM device are considered in the assessment of 4T1R MUX designs characteristics. The comparison with tradition CMOS implementations reveals how the choice of the target resistive state and the programming algorithm are key design aspects to reduce the run-time delay and energy metrics, while at the same time improving the robustness against the different sources of variations.}, language = {en} } @misc{PerezMaldonadoMahadevaiahetal., author = {Perez, Eduardo and Maldonado, David and Mahadevaiah, Mamathamba Kalishettyhalli and Perez-Bosch Quesada, Emilio and Cantudo, Antonio and Jimenez-Molinos, Francisco and Wenger, Christian and Roldan, Juan Bautista}, title = {A comparison of resistive switching parameters for memristive devices with HfO2 monolayers and Al2O3/HfO2 bilayers at the wafer scale}, series = {14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023}, journal = {14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, isbn = {979-8-3503-0240-0}, doi = {10.1109/CDE58627.2023.10339417}, pages = {5}, abstract = {Memristive devices integrated in 200 mm wafers manufactured in 130 nm CMOS technology with two different dielectrics, namely, a HfO2 monolayer and an Al2O3/HfO2 bilayer, have been measured. The cycle-to-cycle (C2C) and device-todevice (D2D) variability have been analyzed at the wafer scale using different numerical methods to extract the set (Vset) and reset (Vreset) voltages. Some interesting differences between both technologies were found in terms of switching characteristics}, language = {en} } @misc{MoralesMahmoodinezhadTschammeretal., author = {Morales, Carlos and Mahmoodinezhad, Ali and Tschammer, Rudi and Kosto, Yuliia and Alvarado Chavarin, Carlos and Schubert, Markus Andreas and Wenger, Christian and Henkel, Karsten and Flege, Jan Ingo}, title = {Combination of Multiple Operando and In-Situ Characterization Techniques in a Single Cluster System for Atomic Layer Deposition: Unraveling the Early Stages of Growth of Ultrathin Al2O3 Films on Metallic Ti Substrates}, series = {Inorganics}, volume = {11}, journal = {Inorganics}, number = {12}, issn = {2304-6740}, doi = {10.3390/inorganics11120477}, abstract = {This work presents a new ultra-high vacuum cluster tool to perform systematic studies of the early growth stages of atomic layer deposited (ALD) ultrathin films following a surface science approach. By combining operando (spectroscopic ellipsometry and quadrupole mass spectrometry) and in situ (X-ray photoelectron spectroscopy) characterization techniques, the cluster allows us to follow the evolution of substrate, film, and reaction intermediates as a function of the total number of ALD cycles, as well as perform a constant diagnosis and evaluation of the ALD process, detecting possible malfunctions that could affect the growth, reproducibility, and conclusions derived from data analysis. The homemade ALD reactor allows the use of multiple precursors and oxidants and its operation under pump and flow-type modes. To illustrate our experimental approach, we revisit the well-known thermal ALD growth of Al2O3 using trimethylaluminum and water. We deeply discuss the role of the metallic Ti thin film substrate at room temperature and 200 °C, highlighting the differences between the heterodeposition (<10 cycles) and the homodeposition (>10 cycles) growth regimes at both conditions. This surface science approach will benefit our understanding of the ALD process, paving the way toward more efficient and controllable manufacturing processes.}, language = {en} } @misc{CapistaLukoseMajnoonetal., author = {Capista, Daniele and Lukose, Rasuole and Majnoon, Farnaz and Lisker, Marco and Wenger, Christian and Lukosius, Mindaugas}, title = {Study on the metal -graphene contact resistance achieved with one -dimensional contact architecture}, series = {IEEE Nanotechnology Materials and Devices Conference (NMDC 2023), Paestum, Italy, 22-25 October 2023}, journal = {IEEE Nanotechnology Materials and Devices Conference (NMDC 2023), Paestum, Italy, 22-25 October 2023}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, isbn = {979-8-3503-3546-0}, doi = {10.1109/NMDC57951.2023.10343775}, pages = {118 -- 119}, abstract = {Graphene has always been considered as one of the materials with the greatest potential for the realization of improved microelectronic and photonic devices. But to actually reach its full potential in Si CMOS technology, graphene -based devices need to overcome different challenges. They do not only need to have better performances than standard devices, but they also need to be compatible with the production of standard Si based devices. To address the first challenge the main route requires the optimization of the contact resistance, that highly reduces the devices performance, while the second challenges requires the integration of graphene inside the standard production lines used for microelectronic. In this work we used an 8" wafer pilot -line to realize our devices and we studied the behavior of the contact resistance between metal and graphene obtained by one -dimensional contact architecture between the two materials. The contact resistance has been measured by means of Transmission Line Method (TLM) with several contact patterning.}, language = {en} } @misc{LukosiusLukoseLiskeretal., author = {Lukosius, Mindaugas and Lukose, Rasuolė and Lisker, Marco and Dubey, P. K. and Raju, A. I. and Capista, Daniele and Majnoon, Farnaz and Mai, A. and Wenger, Christian}, title = {Developments of Graphene devices in 200 mm CMOS pilot line}, series = {Proc. Nanotechnology Materials and Devices Conference (NMDC 2023),Paestum, Italy, 22-25 October 2023}, journal = {Proc. Nanotechnology Materials and Devices Conference (NMDC 2023),Paestum, Italy, 22-25 October 2023}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, isbn = {979-8-3503-3546-0}, doi = {10.1109/NMDC57951.2023.10343569}, pages = {505 -- 506}, abstract = {Due to the unique electronic band structure, graphene has opened great potential to extend the functionality of a large variety of devices. Despite the significant progress in the fabrication of various graphene based microelectronic devices, the integration of graphene devices still lack the stability and compatibility with Si-technology processes. Therefore, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance. This study aims to explore various aspects of graphene research on a 200mm pilot line, with a focus on simulations and fabrication of graphene modulator. To be more precise, it includes design and fabrication of the layouts, necessary mask sets, creation of the flows, fabrication, and measurements of the Gr modulators on 200 mm wafers.}, language = {en} } @misc{MaldonadoCantudoPerezetal., author = {Maldonado, David and Cantudo, Antonio and Perez, Eduardo and Romero-Zaliz, Rocio and Perez-Bosch Quesada, Emilio and Mahadevaiah, Mamathamba Kalishettyhalli and Jimenez-Molinos, Francisco and Wenger, Christian and Roldan, Juan Bautista}, title = {TiN/Ti/HfO2/TiN Memristive Devices for Neuromorphic Computing: From Synaptic Plasticity to Stochastic Resonance}, series = {Frontiers in Neuroscience}, volume = {17}, journal = {Frontiers in Neuroscience}, issn = {1662-4548}, doi = {10.3389/fnins.2023.1271956}, abstract = {We characterize TiN/Ti/HfO2/TiN memristive devices for neuromorphic computing. We analyze different features that allow the devices to mimic biological synapses and present the models to reproduce analytically some of the data measured. In particular, we have measured the spike timing dependent plasticity behavior in our devices and later on we have modeled it. The spike timing dependent plasticity model was implemented as the learning rule of a spiking neural network that was trained to recognize the MNIST dataset. Variability is implemented and its influence on the network recognition accuracy is considered accounting for the number of neurons in the network and the number of training epochs. Finally, stochastic resonance is studied as another synaptic feature.It is shown that this effect is important and greatly depends on the noise statistical characteristics.}, language = {en} } @article{SohalLupinaLippertetal., author = {Sohal, Rakesh and Lupina, Grzegorz and Lippert, Gunther and Wenger, Christian and Seifarth, Olaf and Schr{\"o}der, Thomas and Tallarida, Massimo and Schmeißer, Dieter}, title = {Interface chemistry of high-k PrxAl2-xO3 (x=2-0) dielectrics on TiN for dynamic random access memory applications}, language = {en} }