@misc{PanahandehMayGrosseKockertetal., author = {Panahandeh, Sara and May, Daniel and Grosse-Kockert, Corina and Schacht, Ralph and Abo Ras, Mohamad and Wunderle, Bernhard}, title = {Pulsed infrared thermal imaging as inline quality assessment tool}, series = {Microelectronics Reliability}, volume = {2023}, journal = {Microelectronics Reliability}, number = {Volume 142}, issn = {0026-2714}, doi = {10.1016/j.microrel.2023.114910}, pages = {1 -- 11}, abstract = {Pulsed infrared thermography (PIRT) is a very fast and non-destructive technique for testing various types of specimens. This makes PIRT interesting for 100 \%-inspections in industrial production lines. Especially for the die attach interface inspection of sintered and soldered electronic components and layer-to-layer interfaces in fiber-reinforced plastic (FRP), the industry is looking for alternatives to cost intensive X-ray methods and the time-consuming scanning acoustic microscopy (C-SAM). A big challenge to use the PIRT technology for inspections in industrial production lines is the low emissivity of the surface of the device under test (DUT). This work will present a PIRT system including a vacuum foil lamination setup to avoid the necessary spray coating of DUTs with low emissivity surfaces in failure analyses. This system can be used as inline quality assessment tool with an integrated technique to perform reliable component inspections on a wide range of different specimens.}, language = {en} }