@misc{ZschechHoSchmeisseretal.2011, author = {Ehrenfried Zschech and O. S. Ho and Dieter Schmeißer and Moritz Andreas Meyer and A. V. Vairagar and G. Schneider and Meike Hauschildt and Matthias Kraatz and V. Sukharev}, title = {Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation}, booktitle = {IEEE Transactions on Device and Materials Reliability}, volume = {9}, number = {1}, issn = {1530-4388}, url = {http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=4796372}, institution = {FG Angewandte Physik und Halbleiterspektroskopie}, type = {articler}, pages = {20 -- 30}, year = {2011}, }