TY - GEN A1 - Nowak, Torsten A1 - Merbold, Sebastian A1 - Egbers, Christoph A1 - Schacht, Ralph T1 - Numerical Study with Experimental Validation of Thermal Coupling Phenomena with Flip-Chip Assembled Test Dies on PCB T2 - 24th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, 2018 N2 - Numerical Study with Experimental Validation of Thermal Coupling Phenomena with Flip-Chip Assembled Test Dies on PCB. KW - Thermal Coupling, Flip Chip Y1 - 2020 UR - https://opus4.kobv.de/opus4-UBICO/frontdoor/index/index/docId/25393 SN - 978-1-5386-6759-0 SN - 978-1-5386-6760-6 SN - 2474-1523 SN - 2474-1515 PB - IEEE ER -