@misc{NowakMerboldEgbersetal.2020, author = {Torsten Nowak and Sebastian Merbold and Christoph Egbers and Ralph Schacht}, title = {Numerical Study with Experimental Validation of Thermal Coupling Phenomena with Flip-Chip Assembled Test Dies on PCB}, booktitle = {24th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, 2018}, isbn = {978-1-5386-6759-0}, issn = {2474-1523}, doi = {10.1109/THERMINIC.2018.8593313}, institution = {FG Elektronische Schaltungstechnik}, type = {conferenceobject_ref}, pages = {5}, year = {2020}, }