TY - CONF A1 - Lin, Der-Song A1 - Zhuang, Xuefeng A1 - Wodnicki, Robert A1 - Woychik, Charles. G. A1 - Oralkan, Ă–mer A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Packaging of large and low-pitch size 2D ultrasonic transducer arrays T2 - IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), 2010 Y1 - 2012 UR - https://opus4.kobv.de/opus4-UBICO/frontdoor/index/index/docId/7311 SN - 978-1-424-45761-8 SN - 978-1-4244-5763-2 SP - 508 EP - 511 PB - IEEE CY - Piscataway, NJ ER -