TY - GEN A1 - Ho, Paul S. A1 - Zschech, Ehrenfried A1 - Schmeißer, Dieter A1 - Meyer, Moritz Andreas A1 - Huebner, Rene A1 - Hauschildt, Meike A1 - Zhang, Lijuan A1 - Gall, Martin A1 - Kraatz, Matthias T1 - Scaling effects on microstructure and reliability for cu interconnects KW - scaling KW - microstructure KW - interconnects Y1 - 2011 UR - https://opus4.kobv.de/opus4-UBICO/frontdoor/index/index/docId/5038 ER -