TY - CONF A1 - Hoffmann, Patrick A1 - Schmeißer, Dieter A1 - Engelmann, Hans-Jürgen A1 - Zschech, Ehrenfried A1 - Stegmann, Heiko A1 - Himpsel, Franz J. A1 - Denlinger, Jonathan D. A2 - Tsui, Ting Y. T1 - Characterization of chemical bonding in low-k dielectric materials for interconnect isolation: A XAS and EELS Study T2 - Materials, technology and reliability of low-k dielectrics and copper interconnects, symposium held April 18 - 21, 2006, San Francisco, California Y1 - 2007 UR - https://opus4.kobv.de/opus4-UBICO/frontdoor/index/index/docId/3589 SN - 978-1-55899-870-5 SP - 55 EP - 62 PB - Materials Research Society CY - Warrendale, Pa. ER -