@inproceedings{HoffmannSchmeisserEngelmannetal.2007, author = {Patrick Hoffmann and Dieter Schmeißer and Hans-J{\"u}rgen Engelmann and Ehrenfried Zschech and Heiko Stegmann and Franz J. Himpsel and Jonathan D. Denlinger}, title = {Characterization of chemical bonding in low-k dielectric materials for interconnect isolation: A XAS and EELS Study}, booktitle = {Materials, technology and reliability of low-k dielectrics and copper interconnects, symposium held April 18 - 21, 2006, San Francisco, California}, editor = {Ting Y. Tsui}, pages = {55 -- 62}, year = {2007}, }