TY - CONF A1 - Heim, S. A1 - Friedrich, Daniel A1 - Guttmann, P. A1 - Rehbein, S. A1 - Chumakov, Dmytro A1 - Ritz, Y. A1 - Schneider, G. A1 - Schmeißer, Dieter A1 - Zschech, Ehrenfried T1 - Dynamical X-ray Microscopy Study of Stress-Induced Voiding in Cu Interconnects KW - x-ray KW - Microscopy KW - Interconnects Y1 - 2011 UR - https://opus4.kobv.de/opus4-UBICO/frontdoor/index/index/docId/5056 UR - http://link.aip.org/link/?APCPCS/1143/20/1 ER -