TY - CONF A1 - Hoffmann, Patrick A1 - Schmeißer, Dieter A1 - Himpsel, Franz J. A1 - Engelmann, Hans-Jürgen A1 - Zschech, Ehrenfried A1 - Stegmann, Heiko A1 - Denlinger, Jonathan D. T1 - Characterization of Chemical Bonding in Low-K Dielectric Materials for Interconnect Isolation: XAS and EELS Study T2 - Verhandlungen der Deutschen Physikalischen Gesellschaft ; Reihe 6, Bd. 41 N2 - The use of low dielectric constant materials in the on-chip interconnect process reduces interconnect delay, power dissipation and crosstalk noise. In CVD deposited organo-silicate glass (OSG) the substitution of oxygen in SiO2 by methyl groups (-CH3) reduces the permittivity significantly (from 4.0 in SiO2 to 2.6-3.3 in the OSG). However, plasma processing removes C and H containing molecular groups. Therefore, compositional analysis and chemical bonding characterization of structured films with nanometer resolution is necessary. OSG thin films as-deposited and after plasma treatment are studied using XAS and EELS. In both techniques, the fine structure near the C1s edge allows to identify C-H, C-C, and C-O bonds. XAS spectra have been recorded for non-patterned films and EELS spectra for patterned structures. The chemical bonding is compared for as-deposited and plasma-treated low-k materials. The flu-orescence and the electron yield recorded while XAS measurement are compared. Examination of the C 1s near-edge structures reveal a mod-ified bonding of the remaining C atoms in the plasma-treated sample regions. Y1 - 2015 UR - https://opus4.kobv.de/opus4-UBICO/frontdoor/index/index/docId/13781 SN - 0420-0195 SP - S. 156 PB - Deutsche Physikalische Gesellschaft CY - Bad Honnef ER -