TY - JOUR A1 - Rudolph, Matthias A1 - Tischler, Th. A1 - Kilk, A. A1 - Heinrich, Wolfgang T1 - Via Arrays for Grounding in Multilayer Packaging - Frequency Limits and Design Rules Y1 - 2011 UR - https://opus4.kobv.de/opus4-UBICO/frontdoor/index/index/docId/6043 ER -