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Since the beginning of its development in the 1950s, mixed integer programming (MIP) has been used for a variety of practical application problems, such as sequence optimization. Exact solution techniques for MIPs, most prominently branch-and-cut techniques, have the advantage (compared to heuristics such as genetic algorithms) that they can generate solutions with optimality certificates. The novel process of additive manufacturing opens up a further perspective for their use. With the two common techniques, Wire Arc Additive Manufacturing (WAAM) and Laser Powder Bed Fusion (LPBD), the sequence in which a given component geometry must be manufactured can be planned. In particular, the heat transfer within the component must be taken into account here, since excessive temperature gradients can lead to internal stresses and warpage after cooling. In order to integrate the temperature, heat transfer models (heat conduction, heat radiation) are integrated into a sequencing model. This leads to the problem class of MIPDECO: MIPs with partial differential equations (PDEs) as further constraints. We present these model approaches for both manufacturing techniques and carry out test calculations for sample geometries in order to demonstrate the feasibility of the approach.
We consider two mathematical problems that are connected and occur in the layer-wise production process of a workpiece using Wire-Arc Additive Manufacturing. As the first task, we consider the automatic construction of a honeycomb structure, given the boundary of a shape of interest. In doing this we employ Lloyd’s algorithm in two different realizations. For computing the incorporated Voronoi tesselation we consider the use of a Delaunay triangulation or alternatively, the eikonal equation. We compare and modify these approaches with the aim of combining their respective advantages.
Then in the second task, to find an optimal tool path guaranteeing minimal production time and high quality of the workpiece, a mixed-integer linear programming problem is derived. The model takes thermal conduction and radiation during the process into account and aims to minimize temperature gradients inside the material. Its solvability for standard mixed-integer solvers is demonstrated on several test-instances. The results are compared with manufactured workpieces.